ZHCSUH8B December   2017  – January 2024 FPC202

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Host-Side Control Interface
      2. 7.3.2  LED Control
        1. 7.3.2.1 Configurations with up to eight LEDs per port
      3. 7.3.3  Low-Speed Output Signal Control
      4. 7.3.4  Low-Speed Input Status and Interrupt Generation
      5. 7.3.5  Downstream (Port-Side) I2C Master
      6. 7.3.6  Data Pre-Fetch From Modules
      7. 7.3.7  Scheduled Write
      8. 7.3.8  Protocol Timeouts
      9. 7.3.9  General-Purpose Inputs/Outputs
      10. 7.3.10 Hot-Plug Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 I2C Host-Side Control Interface
      2. 7.4.2 SPI Host-Side Control Interface
        1. 7.4.2.1 SPI Frame Structure
        2. 7.4.2.2 SPI Read Operation
        3. 7.4.2.3 SPI Write Operation
    5. 7.5 Programming
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 SFP/QSFP Port Management
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Sequencing
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2500V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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