ZHCSLX3C June   2017  – September 2020 FPC402

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Host-Side Control Interface
      2. 8.3.2  LED Control
      3. 8.3.3  Low-Speed Output Signal Control
      4. 8.3.4  Low-Speed Input Status and Interrupt Generation
      5. 8.3.5  Downstream (Port-Side) I2C Master
      6. 8.3.6  Data Prefetch From Modules
      7. 8.3.7  Scheduled Write
      8. 8.3.8  Protocol Timeouts
      9. 8.3.9  General-Purpose Inputs and Outputs
      10. 8.3.10 Hot-Plug Support
    4. 8.4 Device Functional Modes
      1. 8.4.1 I2C Host-Side Control Interface
      2. 8.4.2 SPI Host-Side Control Interface
        1. 8.4.2.1 SPI Frame Structure
        2. 8.4.2.2 SPI Read Operation
        3. 8.4.2.3 SPI Write Operation
    5. 8.5 Programming
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 SFP/QSFP Port Management
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Recommended Package Footprint
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision B (August 2018) to Revision C (September 2020)

  • 向 ti.com 发布了完整的生产数据数据表Go
  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Added the recommended foot print for RHU packageGo

Changes from Revision A (October 2017) to Revision B (August 2018)

  • Changed MOD_SDA[0] pin number from: 16 to: 35 Go
  • Changed MOD_SDA[1] pin number from: 5 to: 48Go
  • Changed MOD_SDA[2] pin number from: 48 to: 5Go
  • Changed MOD_SDA[3] pin number from: 35 to: 16Go

Changes from Revision * (June 2017) to Revision A (October 2017)

  • 将“预告信息”更改为“量产数据”Go
  • Updated TPOR (max) Go
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