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ZHCSEP9C december 2015 – december 2020 HD3SS214

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		HD3SS214	UNIT
		ZXH (nFBGA)
		50 PINS
R_θJA	Junction-to-ambient thermal resistance	72.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	35.9	°C/W
R_θJB	Junction-to-board thermal resistance	43.1	°C/W
ψ_JT	Junction-to-top characterization parameter	1.6	°C/W
ψ_JB	Junction-to-board characterization parameter	42.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.