米6体育平台手机版

ZHCSE00E may 2014 – december 2020 HD3SS215

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		HD3SS215		UNIT
THERMAL METRIC⁽¹⁾		RTQ (56 PIN)	ZXH (50 PIN)	UNIT
R_θJA	Junction-to-ambient thermal resistance	90.5	69.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	41.9	35.1	°C/W
R_θJB	Junction-to-board thermal resistance	53.9	40.4	°C/W
ψ_JT	Junction-to-top characterization parameter	1.8	1.6	°C/W
ψ_JB	Junction-to-board characterization parameter	53.4	40.2	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.