ZHCSDQ8 April   2015 HD3SS2522

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adaptive Common Mode Tracking for USB 3.1 MUX
      2. 8.3.2 DFP-to-UFP Attach/Detach Detection
      3. 8.3.3 Plug Orientation/Cable Twist Detection
      4. 8.3.4 VBUS Fault
      5. 8.3.5 VCONN Fault
    4. 8.4 Device Functional Modes
      1. 8.4.1 Unattached.DFP State
      2. 8.4.2 Attached.DFP State
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 USB Type-C DFP Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 USB Type-C Current Advertising
        2. 9.2.2.2 VCONN and VBUS Power Switch Control
        3. 9.2.2.3 Firmware Upgradability
      3. 9.2.3 USB Type-C DFP Circuit Schematics with a Type C Receptacle
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Critical Routes
      2. 11.1.2 General Routing/Placement Rules
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Power supply voltage range, VCC –0.4 4 V
Voltage Range Differential I/O (High bandwidth signal path, AxP/N, BxP/N, CxP/N) –0.4 2.4
Control Pins and Single Ended I/Os including CC1 and CC2 –0.4 VCC + 0.4
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
VIH Input high voltage Control/Status pins 2 VCC V
VIL Input low voltage Control/Status pins –0.1 0.8 V
VI/O(Diff) Differential voltage Switch I/O diff voltage 0 1.6 VPP
VI/O(CM) Common voltage Switch I/O common mode voltage 0 2 V
VI/O Input / output voltage CC_OUT, CC_IN, and selected CC pin for configuration 0 VCC V
VIN Input voltage Selected CC pin for VCONN 0 5.5 V
TA Operating free-air temperature HD3SS2522RHU 0 70 °C

7.4 Thermal Information

THERMAL METRIC(1) HD3SS2521A UNIT
RHU
56 PINS
RθJA Junction-to-ambient thermal resistance 31.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.9
RθJB Junction-to-board thermal resistance 8.5
ψJT Junction-to-top characterization parameter 0.5
ψJB Junction-to-board characterization parameter 8.5
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Supply current VCC = 3.6 V,
SS_OEn, CC_OEn = GND 		0.6 1 mA
I(STANDBY) Standby current VCC = 3.3 V, SS_OEN, CC_OEn = VCC 15 µA
VBUS_FAULT#, VCONN_FAULT#, IMODE1, IMODE2, RST, RSVD, GPIO1, GPIO2
VIT+ Positive-going input threshold voltage 0.45 x VCC 0.75 x VCC V
VIT- Negative-going input threshold voltage 0.25 x VCC 0.55 x VCC V
Vhys nput voltage hysteresis (VIT+ – VIT–) VCC = 3 V 0.3 1 V
RPULL Pullup/pulldown resistor Pullup: VIN = GND,
Pulldown: VIN = VCC, VCC = 3 V 		20 35 50 kΩ
CI Input capacitance VIN = GND or VCC 5 pF
ILGK High-impedance leakage current VIN = GND or VCC, VCC = 3 V,
Pullup/Pulldown disabled		 ±50 nA
VCTRL1, VCTRL2, VBUS_EN
VOL Low-level output voltage IOL(max) = 6 mA (1) GND + 0.3 V
MODE_LED
VOH High-level output voltage IOH(max) = –6 mA (1) VCC – 0.3 V
VOL Low-level output voltage IOL(max) = 6 mA (1) GND + 0.3 V
AxP/N, BxP/N, CxP/N
ILGK High-impedance leakage current VCC = 3.6 V, VIN = 0 V, VOUT = 2 V
(ILKG on open outputs Port B and C) 		130 µA
VCC = 3.6 V, VIN = 0 V, VOUT = 2 V
(ILKG on open outputs Port A) 		4 µA
CC1, CC2
ILGK High-impedance leakage current VCC = 3.6 V, VIN = 0 V,
VOUT = 0 V to 4 V		 1 µA
(1) The maximum total current, IOH(max) and IOL(max), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop specified.

7.6 Timing Requirements

MIN NOM MAX UNIT
AxP/N, BxP/N, CxP/N HIGH-BANDWIDTH SIGNAL PATH
tPD Switch Propagation Delay RSC and RL = 50 Ω 85 ps
tON SS_SEL_IN -to-Switch tON RSC and RL = 50 Ω 70 250 ns
tOFF SS_SEL_IN -to-Switch tOFF 70 250 ns
HD3SS2522 switch_timing_sllsem6.gifFigure 1. Select to Switch tON and tOFF
HD3SS2522 prop_delay_sllsem6.gif
1. Measurements based on an ideal input with zero intra-pair skew on the input, i.e. the input at A to B/C or the input at B/C to A
2. Inter-pair skew is measured from lane to lane on the same channel, e.g. C0 to C1
3. Intra-pair skew is defined as the relative difference from the p and n signals of a single lane
Figure 2. Propagation Delay and Skew

7.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AxP/N, BxP/N, CxP/N
tSK(O) Inter-pair output skew
(channel-channel) 		RSC and RL = 50 Ω 20 ps
tSK(b-b) Inter-pair output skew (bit-bit) 8 ps
CON Outputs ON capacitance VIN = 0 V, outputs open, switch ON 1.5 pF
COFF Outputs OFF capacitance VIN = 0 V, outputs open, switch OFF 1 pF
RON Output ON resistance VCC = 3.3 V, VCM = 0.5 V – 1.5 V,
IO = –8 mA 		5 8 Ω
ΔRON On resistance match between channels VCC = 3.3 V; –0.35 V ≤ VIN ≤ 1.2 V;
IO = –8 mA 		2 Ω
On resistance match between pairs of the same channel 0.7
R(FLAT_ON) On resistance flatness
[RON(MAX) – RON(MIN)]		 VCC = 3.3 V; –0.35 V ≤ VIN ≤ 1.2 V 1.15 Ω
RL Differential input return loss
(VCM = 0 V)		 f = 2.5 GHz –12 dB
f = 4 GHz –11
XTALK Differential crosstalk (VCM = 0 V) f = 2.5 GHz –39 dB
f = 4 GHz –35
OIRR Differential off-isolation (VCM = 0 V) f = 2.5 GHz –22 dB
f = 4 GHz –19
IL Differential insertion loss
(VCM = 0 V)		 f = 2.5 GHz –1.1 dB
f = 4 GHz –1.5
BW Bandwidth At 3 dB 6 GHz
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