ZHCSDQ7
May 2015
HD3SS3212
PRODUCTION DATA.
1
特性
2
应用
3
说明
4
简化电路原理图
5
修订历史记录
6
Device Comparison Table
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
High-Speed Performance Parameters
8.7
Switching Characteristics
9
Parameter Measurement Information
10
Detailed Description
10.1
Overview
10.2
Functional Block Diagram
10.3
Feature Description
10.3.1
Output Enable and Power Savings
10.4
Device Functional Modes
11
Application and Implementation
11.1
Application Information
11.2
Typical Applications
11.2.1
Down Facing Port for USB3.1 Type C
11.2.1.1
Design Requirements
11.2.1.2
Detailed Design Procedure
11.2.1.3
Application Curves
11.2.2
Up Facing Port for USB3.1 Type C
11.2.3
PCIE/SATA/USB
11.2.4
PCIE/eSATA
11.2.5
USB/eSATA
11.2.6
MIPI Camera Serial Interface
12
Power Supply Recommendations
13
Layout
13.1
Layout Guidelines
13.2
Layout Example
14
器件和文档支持
14.1
相关链接
14.2
社区资源
14.3
商标
14.4
静电放电警告
14.5
术语表
15
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
RKS|20
MPQF266C
散热焊盘机械数据 (封装 | 引脚)
RKS|20
QFND312B
订购信息
zhcsdq7_oa
6 Device Comparison Table
OPERATING TEMPERATURE (°C)
PACKAGE
(1)
(2)
ORDERABLE PART NUMBER
0 to 70
RKS
20 pins
HD3SS3212RKSR
–40 to 85
RKS
20 pins
HD3SS3212IRKSR
(1) For the most current package and ordering information, see
机械、封装和可订购信息
.
(2) Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging
.
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