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ZHCSFF0A May 2016 – August 2016 HDC1010

PRODUCTION DATA.

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机械数据 (封装 | 引脚)

YPA|8
- MXBG218

散热焊盘机械数据 (封装 | 引脚)

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7 Specifications

7.1 Absolute Maximum Ratings⁽¹⁾

		MIN	MAX	UNIT
Input Voltage	VDD	-0.3	6	V
	SCL	-0.3	6
	SDA	-0.3	6
	DRDYn	-0.3	6
	ADR0	-0.3	VDD+0.3
	ADR1	-0.3	VDD+0.3
Storage Temperature	T_STG	-65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins ⁽¹⁾	±1000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification –500 500 JESD22-C101, all pins ⁽²⁾	±250	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
V_DD	Supply Voltage	2.7	3	5.5	V
T_A, Temperature Sensor	Ambient Operating Temperature	-40		125	°C
T_A, Humidity Sensor⁽¹⁾	Ambient Operating Temperature	-20		70	°C
T_A, Humidity sensor⁽¹⁾	Functional Operating Temperature	-20		85	°C

(1) See Figure 2

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		HDC1010	UNIT
		DSBGA -YPA
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	98.0	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	0.8	°C/W
R_θJB	Junction-to-board thermal resistance	17.8	°C/W
ψ_JT	Junction-to-top characterization parameter	3.7	°C/W
ψ_JB	Junction-to-board characterization parameter	17.8	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Electrical Characteristics⁽¹⁾

The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. T_A = 30°C, V_DD = 3V, and RH = 40%.

PARAMETER		TEST CONDITION⁽²⁾	MIN⁽³⁾	TYP⁽⁴⁾	MAX⁽³⁾	UNIT
POWER CONSUMPTION
I_DD	Supply Current	RH measurement, bit 12 of 0x02 register = 0⁽⁵⁾		190	220	µA
		Temperature measurement, bit 12 of 0x02 register = 0⁽⁵⁾		160	185	µA
		Sleep Mode		100	200	nA
		Average @ 1 measurement/second, RH (11 bit), bit 12 of 0x02 register = 0⁽⁵⁾⁽⁶⁾		710		nA
		Average @ 1 measurement/second, Temp (11 bit), bit 12 of 0x02 register = 0⁽⁵⁾⁽⁶⁾		590		nA
		Average @ 1 measurement/second, RH (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1⁽⁵⁾⁽⁶⁾		1.3		µA
		Startup (average on Start-up time)		300		µA
I_HEAT	Heater Current⁽⁷⁾	Peak current		7.2		mA
I_HEAT	Heater Current⁽⁷⁾	Average @ 1 measurement/second, RH (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1⁽⁵⁾⁽⁶⁾		50		µA
RELATIVE HUMIDITY SENSOR
RH_ACC	Accuracy	Refer to Figure 2 in Typical Characteristics section.		±2		%RH
RH_REP	Repeatability⁽⁷⁾	14 bit resolution.		±0.1		%RH
RH_HYS	Hysteresis ⁽⁸⁾	10% ≤ RH ≤ 70%		±1		%RH
RH_RT	Response Time⁽⁹⁾	t ₆₃% ⁽¹⁰⁾		15		s
RH_CT	Conversion Time⁽⁷⁾	8 bit resolution		2.50		ms
		11 bit resolution		3.85		ms
		14 bit resolution		6.50		ms
RH_HOR	Operating Range⁽¹¹⁾	Non-condensing	0		100	%RH
RH_LTD	Long Term Drift⁽¹²⁾			±0.25		%RH/yr
TEMPERATURE SENSOR
TEMP_ACC	Accuracy⁽⁷⁾	5°C < T_A< 60°C		±0.2	±0.4	°C
TEMP_REP	Repeatability⁽⁷⁾	14 bit accuracy		±0.1		°C
TEMP_CT	Conversion Time⁽⁷⁾	11 bit accuracy		3.65		ms
TEMP_CT	Conversion Time⁽⁷⁾	14 bit accuracy		6.35		ms
TEMP_OR	Operating Range		-40		125	°C

(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.

(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal values have no prefix.

(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.

(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.

(5) I²C read/write communication and pull-up resistors current through SCL and SDA not included.

(6) Average current consumption while conversion is in progress.

(7) This parameter is specified by design and/or characterization and it is not tested in production.

(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.

(9) Actual response times will vary dependent on system thermal mass and air-flow.

(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.

(11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement offset. The measurement offset will decrease after operating the sensor in this recommended operating range.

(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, out-gassing tapes, adhesives, packaging materials, etc.

7.6 I2C Interface Electrical Characteristics

At T_A=30°C, V_DD=3V (unless otherwise noted)

PARAMETER		TEST CONDITION	MIN	TYP	MAX	UNIT
I2C INTERFACE VOLTAGE LEVEL
VIH	Input High Voltage		0.7xV_DD			V
VIL	Input Low Voltage				0.3xV_DD	V
VOL	Output Low Voltage	Sink current 3mA			0.4	V
HYS	Hysteresis ⁽¹⁾		0.1xV_DD			V
CIN	Input Capacitance on all digital pins			0.5		pF

(1) This parameter is specified by design and/or characterization and it is not tested in production.

7.7 I2C Interface Timing Requirements

PARAMETER		TEST CONDITION	MIN	TYP	MAX	UNIT
I2C INTERFACE VOLTAGE LEVEL
f_SCL	Clock Frequency		10		400	kHz
t_LOW	Clock Low Time		1.3			µs
t_HIGH	Clock High Time		0.6			µs
t_SP	Pulse width of spikes that must be suppressed by the input filter ⁽¹⁾				50	ns
t_START	Device Start-up time	From V_DD ≥ 2.7 V to ready for a conversion⁽¹⁾⁽²⁾		10	15	ms