11.1 Layout Guidelines

The Relative Humidity sensor element is located on the top side of the package.

It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device (GND, V_DD) and creating a slot into the PCB around the sensor to enhance thermal isolation.

11.2 Layout Example

The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent on the temperature, the HDC1050 should be positioned away from hot spots present on the board, such as a battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a quicker response to environmental changes. The DAP may be soldered to a floating pad on the board, but the board pad should NOT be connected to GND.

Figure 17. Layout