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ZHCSSF8A September 2000 – August 2023 INA141

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		INA141	UNIT
		D (SOIC)
		8 PINS
θ_JA	Junction-to-ambient thermal resistance	150	°C/W
R_θJA	Junction-to-ambient thermal resistance	110	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	57	°C/W
R_θJB	Junction-to-board thermal resistance	54	°C/W
ψ_JT	Junction-to-top characterization parameter	11	°C/W
ψ_JB	Junction-to-board characterization parameter	53	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.