ZHCSFN6F March   2007  – June 2021 INA203 , INA204 , INA205

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Current-Shunt Monitor
    6. 6.6 Electrical Characteristics: Comparator
    7. 6.7 Electrical Characteristics: Reference
    8. 6.8 Electrical Characteristics: General
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Basic Connections
      2. 7.3.2 Selecting RSHUNT
      3. 7.3.3 Comparator
      4. 7.3.4 Comparator Delay (14-Pin Version Only)
      5. 7.3.5 Comparator Maximum Input Voltage Range
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Filtering
      2. 7.4.2 Accuracy Variations as a Result Of VSENSE and Common-Mode Voltage
        1. 7.4.2.1 Normal Case 1: VSENSE ≥ 20 mV, VCM ≥ VS
        2. 7.4.2.2 Normal Case 2: VSENSE ≥ 20 mV, VCM < VS
        3. 7.4.2.3 Low VSENSE Case 1
        4. 7.4.2.4 Low VSENSE Case 2: VSENSE < 20 mV, 0 V ≤ VCM ≤ VS
      3. 7.4.3 Transient Protection
      4. 7.4.4 Output Voltage Range
      5. 7.4.5 Reference
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • DGS|10
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC (1)INA20xUNIT
D (SOIC)DGS (VSSOP)PW (TSSOP)
14 PINS10 PINS14 PINS
RθJAJunction-to-ambient thermal resistance84.9161.3112.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance4436.837.2°C/W
RθJBJunction-to-board thermal resistance39.482.355.4°C/W
ψJTJunction-to-top characterization parameter10.31.32.7°C/W
ψJBJunction-to-board characterization parameter39.180.854.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance150200150°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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