ZHCSO32C September   2000  – January 2022 INA126 , INA2126

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: INA126
    5. 6.5 Thermal Information: INA2126
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single-Supply Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Gain
        2. 8.2.2.2 Offset Trimming
        3. 8.2.2.3 Input Bias Current Return
        4. 8.2.2.4 Input Common-Mode Range
        5. 8.2.2.5 Input Protection
        6. 8.2.2.6 Channel Crosstalk—Dual Version
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Low-Voltage Operation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 PSpice® for TI
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information: INA126

THERMAL METRIC(1) INA126 UNIT
PDIP SOIC VSSOP
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 52.2 116.4 167.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.6 62.4 60.9 °C/W
RθJB Junction-to-board thermal resistance 29.4 57.7 88.9 °C/W
ψJT Junction-to-top characterization parameter 18.9 10.0 7.3 °C/W
ψJB Junction-to-board characterization parameter 29.2 57.1 87.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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