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ZHCSO32C September 2000 – January 2022 INA126 , INA2126

PRODUCTION DATA

6.5 Thermal Information: INA2126

THERMAL METRIC⁽¹⁾		INA2126			UNIT
		PDIP	SOIC	SSOP
		16 PINS	16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	39.3	76.2	115.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	26.2	37.8	67.0	°C/W
R_θJB	Junction-to-board thermal resistance	20.1	33.5	58.3	°C/W
ψ_JT	Junction-to-top characterization parameter	10.7	7.5	19.9	°C/W
ψ_JB	Junction-to-board characterization parameter	19.9	33.3	57.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.