ZHCSFN9G August   2008  – December 2015 INA219

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Related Products
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics:
    6. 7.6 Bus Timing Diagram Definitions
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic ADC Functions
        1. 8.3.1.1 Power Measurement
        2. 8.3.1.2 PGA Function
        3. 8.3.1.3 Compatibility With TI Hot Swap Controllers
    4. 8.4 Device Functional Modes
      1. 8.4.1 Filtering and Input Considerations
    5. 8.5 Programming
      1. 8.5.1 Programming the Calibration Register
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default Settings
      5. 8.5.5 Bus Overview
        1. 8.5.5.1 Serial Bus Address
        2. 8.5.5.2 Serial Interface
      6. 8.5.6 Writing to and Reading from the INA219
        1. 8.5.6.1 High-Speed I2C Mode
        2. 8.5.6.2 Power-Up Conditions
    6. 8.6 Register Maps
      1. 8.6.1 Register Information
      2. 8.6.2 Register Details
        1. 8.6.2.1 Configuration Register (address = 00h) [reset = 399Fh]
      3. 8.6.3 Data Output Registers
        1. 8.6.3.1 Shunt Voltage Register (address = 01h)
        2. 8.6.3.2 Bus Voltage Register (address = 02h)
        3. 8.6.3.3 Power Register (address = 03h) [reset = 00h]
        4. 8.6.3.4 Current Register (address = 04h) [reset = 00h]
      4. 8.6.4 Calibration Register
        1. 8.6.4.1 Calibration Register (address = 05h) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Register Results for the Example Circuit
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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