ZHCSAQ1D February   2013  – July 2022 INA231

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C Bus
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic Analog-to-Digital Converter (ADC) Functions
        1. 8.3.1.1 Power Calculation
        2. 8.3.1.2 ALERT Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
    5. 8.5 Programming
      1. 8.5.1 Configure, Measure, and Calculate Example
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default INA231 Settings
      5. 8.5.5 Writing to and Reading from the INA231
        1. 8.5.5.1 Bus Overview
          1. 8.5.5.1.1 Serial Bus Address
          2. 8.5.5.1.2 Serial Interface
        2. 8.5.5.2 High-Speed I2C Mode
      6. 8.5.6 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Configuration Register (00h, Read/Write)
        1. 8.6.1.1 AVG Bit Settings [11:9]
        2. 8.6.1.2 VBUS CT Bit Settings [8:6]
        3. 8.6.1.3 VSH CT Bit Settings [5:3]
        4. 8.6.1.4 Mode Settings [2:0]
      2. 8.6.2 Shunt Voltage Register (01h, Read-Only)
      3. 8.6.3 Bus Voltage Register (02h, Read-Only)
      4. 8.6.4 Power Register (03h, Read-Only)
      5. 8.6.5 Current Register (04h, Read-Only)
      6. 8.6.6 Calibration Register (05h, Read/Write)
      7. 8.6.7 Mask/Enable Register (06h, Read/Write)
      8. 8.6.8 Alert Limit Register (07h, Read/Write)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Filtering and Input Considerations
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YFF|12
  • YFD|12
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)INA231UNIT
YFD (DSBGA)YFF (DSBGA)
12 PINS12 PINS
RθJAJunction-to-ambient thermal resistance83.890.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance0.40.5°C/W
RθJBJunction-to-board thermal resistance19.340.0°C/W
ψJTJunction-to-top characterization parameter0.33.0°C/W
ψJBJunction-to-board characterization parameter19.439.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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