SBOS485C November   2009  – May 2015 INA282 , INA283 , INA284 , INA285 , INA286

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Selecting RS
      2. 7.3.2 Effective Bandwidth
      3. 7.3.3 Transient Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reference Pin Connection Options
        1. 7.4.1.1 Unidirectional Operation
          1. 7.4.1.1.1 Ground Referenced Output
          2. 7.4.1.1.2 V+ Referenced Output
        2. 7.4.1.2 Bidirectional Operation
          1. 7.4.1.2.1 External Reference Output
          2. 7.4.1.2.2 Splitting The Supply
          3. 7.4.1.2.3 Splitting an External Reference
      2. 7.4.2 Shutdown
      3. 7.4.3 Extended Negative Common-Mode Range
      4. 7.4.4 Calculating Total Error
        1. 7.4.4.1 Example 1
        2. 7.4.4.2 Example 2
  8. Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
    2. 8.2 Typical Applications
      1. 8.2.1 Current Summing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Current Differencing
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (September 2012) to C Revision

  • Added DGK (VSSOP) package to data sheetGo
  • Changed front page diagramGo
  • Added ESD Ratings and Recommended Operating Conditions tables, and Feature Description, Application and Implementation, Power Supply Recommendations ,Layout , Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Machine Model ESD ratingGo
  • Changed HBM ESD rating from ±3000 V to ±2000 VGo
  • Added RVRR as symbol for reference voltage rejection ratio Go
  • Changed order of figures in Typical Characteristics sectionGo
  • Changed Figure 16Go
  • Changed VDRIVE condition in Figure 19 and Figure 20Go
  • Added functional block diagramGo
  • Changed Figure 32 and Figure 33Go
  • Changed Figure 34 and Figure 35Go
  • Changed Figure 36 and Figure 37Go
  • Changed Figure 38Go
  • Changed Reference Common-Mode Rejection to Reference Voltage Rejection RatioGo
  • Changed RCMR to RVRR in Table 1 and Table 2Go
  • Changed Figure 39Go
  • Changed Figure 40Go
  • Changed Figure 42Go

Changes from A Revision (July 2010) to B Revision

  • Changed devices from product preview to production data.Go