ZHCSEX8B December   2015  – December 2021 INA300-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Selecting a Current-Sensing Resistor
        1. 7.3.1.1 Selecting a Current-Sensing Resistor: Example
      2. 7.3.2 Setting The Current-Limit Threshold
        1. 7.3.2.1 Resistor-Controlled Current Limit
        2. 7.3.2.2 Voltage Source-Controlled Current Limit
      3. 7.3.3 Delay Setting
      4. 7.3.4 Alert Timing Response
      5. 7.3.5 Selectable Hysteresis
      6. 7.3.6 Alert Output
      7. 7.3.7 Noise Adjustment Factor (NAF)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Mode
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
      2. 7.4.2 Disable Mode
      3. 7.4.3 Input Filtering
      4. 7.4.4 Using the INA300-Q1 INA300-Q1 With Common-Mode Transients Above 36 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Operation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Window Comparator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)INA300-Q1UNIT
DGS (VSSOP)
10 PINS
RθJAJunction-to-ambient thermal resistance169.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance59.1°C/W
RθJBJunction-to-board thermal resistance89.6°C/W
ψJTJunction-to-top characterization parameter8.5°C/W
ψJBJunction-to-board characterization parameter88.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |