ZHCSC46C February   2014  – June 2021 INA300

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Selecting a Current-Sensing Resistor
        1. 7.3.1.1 Selecting a Current-Sensing Resistor: Example
      2. 7.3.2 Setting The Current-Limit Threshold
        1. 7.3.2.1 Resistor-Controlled Current Limit
        2. 7.3.2.2 Voltage Source-Controlled Current Limit
      3. 7.3.3 Delay Setting
      4. 7.3.4 Alert Timing Response
      5. 7.3.5 Selectable Hysteresis
      6. 7.3.6 Alert Output
      7. 7.3.7 Noise Adjustment Factor (NAF)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Mode
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
      2. 7.4.2 Disable Mode
      3. 7.4.3 Input Filtering
      4. 7.4.4 Using the INA300 INA300 With Common-Mode Transients Above 36 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Operation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Window Comparator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)INA300UNIT
DSQ (WSON)DGS (VSSOP)
10 PINS10 PINS
RθJAJunction-to-ambient thermal resistance63.5169.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance79.559.1°C/W
RθJBJunction-to-board thermal resistance33.989.6°C/W
ψJTJunction-to-top characterization parameter7.88.5°C/W
ψJBJunction-to-board characterization parameter34.388.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance7.5n/a°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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