ZHCSF49B April   2016  – April 2022 INA301-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Alert Output ( ALERT Pin)
      2. 7.3.2 Current-Limit Threshold
        1. 7.3.2.1 Resistor-Controlled Current Limit
          1. 7.3.2.1.1 Resistor-Controlled, Current-Limit Example
        2. 7.3.2.2 Voltage-Source-Controlled Current Limit
      3. 7.3.3 Hysteresis
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Mode
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Selecting a Current-Sensing Resistor
        1. 8.1.1.1 Selecting a Current-Sensing Resistor Example
      2. 8.1.2 Input Filtering
      3. 8.1.3 INA301-Q1 Operation With Common-Mode Voltage Transients Greater Than 36 V
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)INA301-Q1UNIT
DGK (VSSOP)
8 PINS
RθJAJunction-to-ambient thermal resistance161.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance62.3°C/W
RθJBJunction-to-board thermal resistance81.4°C/W
ψJTJunction-to-top characterization parameter6.8°C/W
ψJBJunction-to-board characterization parameter80°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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