ZHCSIX9B october   2018  – october 2020 ISO1042-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Transient Immunity
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Ratings
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Safety Limiting Values
    10. 6.10 Electrical Characteristics - DC Specification
    11. 6.11 Switching Characteristics
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Test Circuits
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Timeout (DTO)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout and Default State
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 Unpowered Device
        6. 8.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DW-16 PACKAGE
ISSafety input, output, or supply currentRθJA = 69.9°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 6-1325mA
RθJA = 69.9°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 6-1496
RθJA = 69.9°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 6-1650
RθJA = 69.9°C/W, VI = 1.89 V, TJ = 150°C, TA = 25°C, see Figure 6-1946
PSSafety input, output, or total powerRθJA = 69.9°C/W, TJ = 150°C, TA = 25°C, see Figure 6-31788mW
TSMaximum safety temperature150°C
DWV-8 PACKAGE
ISSafety input, output, or supply currentRθJA = 100°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 6-2227mA
RθJA = 100°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 6-2347
RθJA = 100°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 6-2454
RθJA = 100°C/W, VI = 1.89 V, TJ = 150°C, TA = 25°C, see Figure 6-2661
PSSafety input, output, or total powerRθJA = 100°C/W, TJ = 150°C, TA = 25°C, see Figure 6-41250mW
TSMaximum safety temperature150°C
The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.