ZHCSGU8E June   2017  – August 2018 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.          应用图表
      2.      ISO121x 器件与传统解决方案相比可降低电路板温度
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—DC Specification
    10. 6.10 Switching Characteristics—AC Specification
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Sinking Inputs
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 9.2.1.2.2 Thermal Considerations
          3. 9.2.1.2.3 Designing for 48-V Systems
          4. 9.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 9.2.1.2.5 Surge, ESD, and EFT Tests
          6. 9.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 9.2.1.2.7 Status LEDs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Sourcing Inputs
      3. 9.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBQ|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.10 Switching Characteristics—AC Specification

(Over recommended operating conditions unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tr, tf Output signal rise and fall time, OUTx pins Input rise and fall times = 10 ns, see Figure 10 3 ns
tPLH Propagation delay time for low to high transition Input rise and fall times = 10 ns, see Figure 10 110 140 ns
tPHL Propagation delay time for high to low transition Input rise and fall times = 10 ns, see Figure 10 10 15 ns
tsk(p) Pulse skew |tPHL - tPLH| Input rise and fall times = 10 ns, see Figure 10 102 130 ns
tUI Minimum pulse width Input rise and fall times = 125 ns, see Figure 10 150 ns
tPHZ Disable propagation delay, high-to-high impedance output See Figure 13 17 40 ns
tPLZ Disable propagation delay, low-to-high impedance output See Figure 12 17 40 ns
tPZH Enable propagation delay, high impedance-to-high output See Figure 13 3 8.5 µs
tPZL Enable propagation delay, high impedance-to-low output See Figure 12 17 40 ns
CMTI Common mode transient immunity See Figure 14 25 70 kV/µs
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