ZHCSGU8E June   2017  – August 2018 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.          应用图表
      2.      ISO121x 器件与传统解决方案相比可降低电路板温度
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—DC Specification
    10. 6.10 Switching Characteristics—AC Specification
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Sinking Inputs
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 9.2.1.2.2 Thermal Considerations
          3. 9.2.1.2.3 Designing for 48-V Systems
          4. 9.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 9.2.1.2.5 Surge, ESD, and EFT Tests
          6. 9.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 9.2.1.2.7 Status LEDs
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Sourcing Inputs
      3. 9.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBQ|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (March 2018) to E Revision

  • Changed VIH and VIH to VIL and VIH in the RTHR resistor description in the Setting Current Limit and Voltage Thresholds sectionGo

Changes from C Revision (February 2018) to D Revision

  • 更新了特性 和应用 部分。在说明 和相关文档 部分中添加了新的 TI 技术手册参考。Go
  • Changed the unit for CPG from µm to mm in the Insulation Specifications tableGo
  • Changed the Functional Block DiagramGo
  • Changed VIL from min to typ in the VIL equationGo
  • Added the Designing for Input Voltages Greater Than 60 V sectionGo
  • Added the bidirectional implementation example to the Sourcing and Sinking Inputs sectionGo

Changes from B Revision (September 2017) to C Revision

  • Added 将断线检测添加到特性 部分Go
  • Added 将多路复用器输出信号使能引脚添加到了特性 部分中，更改了所有需要为 DW 和 D 封装完成的认证Go
  • Changed RTHR = 5 kΩ to 4 kΩ in the High-Level Voltage Transition Threshold vs Ambient Temperature graphGo
  • Changed the Type 1 RTH value from 3 kΩ to 2.5 kΩ in the Surge, IEC ESD and EFT tableGo

Changes from A Revision (September 2017) to B Revision

  • Changed 将状态从预告信息改为生产数据Go
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