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ZHCSFS4D November 2016 – December 2022 ISO1540-Q1 , ISO1541-Q1

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		ISO154x-Q1	UNIT
		D (SOIC)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	114.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	69.6	°C/W
R_θJB	Junction-to-board thermal resistance	55.3	°C/W
ψ_JT	Junction-to-top characterization parameter	27.2	°C/W
ψ_JB	Junction-to-board characterization parameter	54.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).