Features are integrated in the ISO1640-Q1 to help protect the device from high current events. Enhanced ESD protection cells are designed on the I²C bus pins to support 10 kV HBM ESD on side 1 and 14 kV HBM ESD on side 2. The I²C bus pins on side 2 are designed to withstand an unpowered IEC-ESD strike of 8 kV, improving robustness and system reliability in hot swap applications. In addition to the improved ESD performance, a short circuit protection circuit is included on side 2 to protect the bus pins (SDA2 and SCL2) against strong short circuits of 5 ohms or less to VCC2.

Thermal shutdown is integrated in the ISO1640-Q1 to protect the device from high current events. If the junction temperature of the device exceeds the thermal shutdown threshold of 190°C (typical), the device turns off, disabling the I²C circuits and releasing the bus. The shutdown condition is cleared when the junction temperature drops at least the thermal shutdown hysteresis temperature of 10°C (typical) below the thermal shutdown temperature of the device.