SLLSFC3A March   2020  – December 2021 ISO1640-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6.     Insulation Specifications
    7. 6.6  Safety-Related Certifications
    8. 6.7  Safety Limiting Values
    9. 6.8  Electrical Characteristics
    10. 6.9  Supply Current Characteristics
    11. 6.10 Timing Requirements
    12. 6.11 Switching Characteristics
    13. 6.12 Insulation Characteristics Curves
    14. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Isolation Technology Overview
    4. 8.4 Feature Description
      1. 8.4.1 Hot Swap
      2. 8.4.2 Protection Features
    5. 8.5 Isolator Functional Principle
      1. 8.5.1 Receive Direction (Left Diagram of Figure 1-1 )
      2. 8.5.2 Transmit Direction (Right Diagram of Figure 1-1 )
    6. 8.6 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 I2C Bus Overview
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply Voltage VCC1, VCC2 –0.5 6 V
Input/Output Voltage SDA1, SCL1 –0.5 VCCX + 0.5(3) V
SDA2, SCL2 –0.5 VCCX + 0.5(3)
Input/Output Current SDA1, SCL1 0 20 mA
SDA2, SCL2 0 100
Temperature Maximum junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the local ground pin (GND1 or GND2) and are peak voltage values.
(3) During powered off hotswap, the bus pins can go 0 V < SDAx, SCLx < 6 V. 
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