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ZHCS029E January 2011 – August 2023 ISO3086T

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		ISO308x	UNIT
		DW (SOIC)
		16 PINS
R_θJA	Junction-to-ambient thermal resistance	80.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	43.8	°C/W
R_θJB	Junction-to-board thermal resistance	49.7	°C/W
ψ_JT	Junction-to-top characterization parameter	13.8	°C/W
ψ_JB	Junction-to-board characterization parameter	41.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.