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ZHCSLQ2F january 2020 – february 2023 ISO6720 , ISO6721 , ISO6721R

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC ^⁽¹⁾		ISO672xB	ISO6721RB	UNIT
		D (SOIC)	D (SOIC)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	104.6	98.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	48.9	33.8	°C/W
R_θJB	Junction-to-board thermal resistance	52.9	47	°C/W
ψ_JT	Junction-to-top characterization parameter	7.9	2.3	°C/W
ψ_JB	Junction-to-board characterization parameter	52.1	46.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.