ZHCSK04C July   2019  – May 2024 ISO7021

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics 5V Supply
    10. 6.10 Supply Current Characteristics 5V Supply
    11. 6.11 Electrical Characteristics 3.3V Supply
    12. 6.12 Supply Current Characteristics 3.3V Supply
    13. 6.13 Electrical Characteristics 2.5V Supply
    14. 6.14 Supply Current Characteristics 2.5V Supply
    15. 6.15 Electrical Characteristics 1.8V Supply
    16. 6.16 Supply Current Characteristics 1.8V Supply
    17. 6.17 Switching Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Refresh
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Insulation Lifetime
      2. 9.1.2 Intrinsic Safety
        1. 9.1.2.1 Schedule of Limitations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

ESD Ratings

(1)(2)
VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±6000 V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) ±1500
Contact discharge per IEC 61000-4-2; Isolation barrier withstand test(3)(4) ±8000
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
IEC ESD strike is applied across the barrier with all pins on each side tied together creating a two-terminal device.
Testing is carried out in air or oil to determine the intrinsic contact discharge capability of the device.