米6体育平台手机版

ZHCSK04C July 2019 – May 2024 ISO7021

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		ISO7021	UNIT
		D (SOIC)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	94.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	28.6	°C/W
R_θJB	Junction-to-board thermal resistance	43.6	°C/W
ψ_JT	Junction-to-top characterization parameter	2.3	°C/W
ψ_JB	Junction-to-board characterization parameter	42.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.