ZHCSJ22B October   2017  – July 2019 ISO7041

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化应用电路原理图
      2.      电压为 3.3V 时的数据速率与功耗间的关系
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics 5V Supply
    10. 7.10 Supply Current Characteristics 5V Supply
    11. 7.11 Electrical Characteristics 3.3V Supply
    12. 7.12 Supply Current Characteristics 3.3V Supply
    13. 7.13 Electrical Characteristics 2.5V Supply
    14. 7.14 Supply Current Characteristics 2.5V Supply
    15. 7.15 Switching Characteristics
    16. 7.16 Insulation Characteristics Curves
    17. 7.17 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Refresh Enable
      2. 9.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Insulation Lifetime
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Overview

The ISO7041 device uses edge encoding of data with an ON-OFF keying (OOK) modulation scheme to transmit the digital data across a silicon dioxide isolation barrier. The transmitter uses a high frequency carrier signal to pass data across the barrier representing a signal edge transition. Using this method achieves very low power consumption and high immunity. The receiver demodulates the carrier signal after advanced signal conditioning and produces the output through a buffer stage. For low data rates, a refresh logic option is available to make sure the output state matches the input state. The ENx pins of side A and side B must be tied low to enable refresh or high to disable refresh. Advanced circuit techniques are used to maximize the CMTI performance and minimize the radiated emissions due the high frequency carrier and IO buffer switching. The conceptual block diagram of a digital capacitive isolator, Figure 12, shows a functional block diagram of a typical channel.