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ZHCSHF6M January 2006 – October 2024 ISO721 , ISO721M , ISO722 , ISO722M

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾			ISO72x	UNIT
			D (SOIC)
			8 PINS
R_θJA	Junction-to-ambient thermal resistance	High-K Board	114.7	°C/W
R_θJA	Junction-to-ambient thermal resistance	Low-K Board	263	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance		63	°C/W
R_θJB	Junction-to-board thermal resistance		54.8	°C/W
ψ_JT	Junction-to-top characterization parameter		18.9	°C/W
ψ_JB	Junction-to-board characterization parameter		54.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance		N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.