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PRODUCTION DATA.

THERMAL METRIC⁽¹⁾			ISO7220x ISO7221x	UNIT
			D (SOIC)
			8 PINS
R_θJA	Junction-to-ambient thermal resistance	Low-K Thermal Resistance⁽²⁾	212	°C/W
R_θJA	Junction-to-ambient thermal resistance	High-K Thermal Resistance	122	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance		69.1	°C/W
R_θJB	Junction-to-board thermal resistance		47.7	°C/W
ψ_JT	Junction-to-top characterization parameter		15.2	°C/W
ψ_JB	Junction-to-board characterization parameter		47.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance		—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.