ZHCSX85L September   2007  – October 2024 ISO7230C , ISO7231C , ISO7231M

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 3.3 V
    10. 6.10 Electrical Characteristics: VCC1 and VCC2 at 5-V
    11. 6.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V
    12. 6.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    13. 6.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V
    14. 6.14 Switching Characteristics: VCC1 and VCC2 at 5-V
    15. 6.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V
    16. 6.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
        1. 9.2.3.1 Insulation Characteristics Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Revision History

Changes from Revision K (October 2015) to Revision L (October 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 通篇将“VDE V 0884-11”更新为“DIN VDE 0884-17”Go
  • 通篇将引用内容从电容隔离更新为隔离栅Go
  • Updated Thermal Characteristics, Safety Limiting Values, and Thermal Derating Curves to provide more accurate system-level thermal calculationsGo
  • Updated the Regulatory Information tableGo
  • Updated electrical and switching characteristics to match device performanceGo
  • Moved the Insulation Characteristics Curves to the Application Curves sectionGo

Changes from Revision J (May 2015) to Revision K (October 2015)

  • Added Note 1 to L(I01) and changed the MIN value From: 8.34 To 8 mm in the Insulation Specifications tableGo
  • Added Note 1 to LI02) and changed the MIN value From: 8.1 To 8 mm in the Insulation Specifications tableGo
  • Deleted Note 1 From the Safety-Related Certifications tableGo
  • Changed The ground symbols on the Enable circuit in the Device I/O Schematics imagesGo
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