ZHCSX85L September   2007  – October 2024 ISO7230C , ISO7231C , ISO7231M

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 3.3 V
    10. 6.10 Electrical Characteristics: VCC1 and VCC2 at 5-V
    11. 6.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V
    12. 6.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    13. 6.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V
    14. 6.14 Switching Characteristics: VCC1 and VCC2 at 5-V
    15. 6.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V
    16. 6.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V
    17. 6.17 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
        1. 9.2.3.1 Insulation Characteristics Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

ISO7230 和 ISO7231 是三通道数字隔离器,每个隔离器都具有多个通道配置和输出使能功能。这些器件具有由 TI 的二氧化硅 (SiO2) 隔离栅进行隔离的逻辑输入和输出缓冲器。当与隔离电源结合使用时,这些器件可阻止高电压和隔离接地,并可防止数据总线或其他电路上的噪声电流进入本地接地或对敏感电路造成干扰或损坏。

封装信息
器件型号 封装(1) 本体尺寸(标称值) 封装尺寸(2)
ISO7230C
ISO7231C
ISO7231M
DW(SOIC,16) 10.30mm × 7.50mm 10.30mm × 10.30mm
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
封装尺寸(长 × 宽)为标称值,并包括引脚(如适用)。
ISO7230C ISO7231C ISO7231M 简化版原理图
VCCI 和 GNDI 分别是输入通道的电源和接地连接引脚。
VCCO 和 GNDO 分别是输出通道的电源和接地连接引脚。
简化版原理图