SLLSE40B September   2010  – November 2024 ISO7240CF-Q1 , ISO7241C-Q1 , ISO7242C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Characteristics
    5. 5.5  Power Ratings
    6. 5.6  Safety-Related Certifications
    7. 5.7  Safety Limiting Values
    8. 5.8  Insulation Specifications
    9. 5.9  Electrical Characteristics: VCC1 and VCC2 at 5-V Operation
    10. 5.10 Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation
    11. 5.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    12. 5.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    13. 5.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
    14. 5.14 Switching Characterstics: VCC1 and VCC2 at 5-V Operation
    15. 5.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation
    16. 5.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    17. 5.17 Insulation Characteristics Curves
    18. 5.18 Typical Characteristic
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Isolated Data Acquisition System for Process Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Isolated SPI for an Analog Input Module with 16 Inputs
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Isolated RS-232 Interface
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Related Links
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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