SLLSE40B September   2010  – November 2024 ISO7240CF-Q1 , ISO7241C-Q1 , ISO7242C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Characteristics
    5. 5.5  Power Ratings
    6. 5.6  Safety-Related Certifications
    7. 5.7  Safety Limiting Values
    8. 5.8  Insulation Specifications
    9. 5.9  Electrical Characteristics: VCC1 and VCC2 at 5-V Operation
    10. 5.10 Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation
    11. 5.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    12. 5.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    13. 5.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
    14. 5.14 Switching Characterstics: VCC1 and VCC2 at 5-V Operation
    15. 5.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation
    16. 5.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    17. 5.17 Insulation Characteristics Curves
    18. 5.18 Typical Characteristic
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Isolated Data Acquisition System for Process Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Isolated SPI for an Analog Input Module with 16 Inputs
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Isolated RS-232 Interface
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Related Links
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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5.7 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current RθJA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C, see Thermal Characteristics 124 mA
RθJA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C, see Thermal Characteristics 190
TS Safety temperature 150 °C
(1) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
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