ZHCSG31 March 2017 ISO7710-Q1
PRODUCTION DATA.
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| DW-16 Package | ||||||
| IS | Safety input, output, or supply current | RθJA = 94.4 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 1 | 241 | mA | ||
| RθJA = 94.4 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 1 | 368 | |||||
| RθJA = 94.4 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C,
see Figure 1 |
482 | |||||
| PS | Safety input, output, or total power | RθJA = 94.4 °C/W, TJ = 150°C, TA = 25°C, see Figure 2 | 1324 | mW | ||
| TS | Maximum safety temperature | 150 | °C | |||
| D-8 Package | ||||||
| IS | Safety input, output, or supply current | RθJA = 146.1 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 3 | 156 | mA | ||
| RθJA = 146.1 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C,
see Figure 3 |
238 | |||||
| RθJA = 146.1 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 3 | 311 | |||||
| PS | Safety input, output, or total power | RθJA = 146.1 °C/W, TJ = 150°C, TA = 25°C, see Figure 4 | 856 | mW | ||
| TS | Maximum safety temperature | 150 | °C | |||
The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a High-K test board for leaded surface mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.