ZHCSFH4J September   2016  – October 2024 ISO7730 , ISO7731

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply 
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Insulation Lifetime
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

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Revision History

Changes from Revision I (August 2023) to Revision J (October 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated distance through isolation, while maintaining other insulation specificationsGo
  • Updated the input leakage current for ENx pins throughout the electrical characteristic sections Go
  • Updated the TDDB plot and the projected lifetimeGo
  • Deleted the Community Resources section and added the Support Resources sectionGo

Changes from Revision H (March 2023) to Revision I (August 2023)

  • Updated Thermal Characteristics, Safety Limiting Values, and Thermal Derating Curves to provide more accurate system-level thermal calculationsGo
  • Updated electrical and switching characteristics to match device performanceGo

Changes from Revision G (March 2020) to Revision H (March 2023)

  • 将整个文档中的标准名称从“DIN V VDE V 0884-11:2017-01”更改为“DIN EN IEC 60747-17 (VDE 0884-17)”Go
  • 通篇删除了对标准 IEC/EN/CSA 60950-1 的引用Go
  • 通篇删除了所有标准名称中的标准版本和年份参考Go
  • Added Maximum impulse voltage (VIMP) specification per DIN EN IEC 60747-17 (VDE 0884-17)Go
  • Changed test conditions and values of Maximum surge isolation voltage (VIOSM) specification per DIN EN IEC 60747-17 (VDE 0884-17)Go
  • Clarified method b test conditions of Apparent charge (qPD)Go
  • Changed values of Maximum surge isolation voltage (VIOSM) specification per DIN EN IEC 60747-17 (VDE 0884-17)Go