ZHCST02A September   2023  – December 2023 ISOM8110

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Selection
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Insulation Specifications
    5. 7.5 Safety-Related Certifications
    6. 7.6 Safety Limiting Values
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
        2. 10.1.1.2 Detailed Design Procedure
        3. 10.1.1.3 Application Curves
    2. 10.2 Power Supply Recommendations
    3. 10.3 Layout
      1. 10.3.1 Layout Guidelines
      2. 10.3.2 Layout Example
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.1.1 Design Requirements

To design with ISOM811x devices, use the parameters listed in Table 10-1.

Table 10-1 Design Parameters
PARAMETER VALUE

Input forward current range, IF

0.5 mA (min), 50 mA (max)
Current transfer ratio at IF = 5 mA, CTR 100% to 155%
Collector current tolerance, IC 50 mA (max)
Collector-emitter voltage (saturation), VCE(SAT) 0.3 V (max)
Input forward voltage, VF 1.2 V (typ)
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