ZHCST02A September   2023  – December 2023 ISOM8110

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Selection
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Insulation Specifications
    5. 7.5 Safety-Related Certifications
    6. 7.6 Safety Limiting Values
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
        2. 10.1.1.2 Detailed Design Procedure
        3. 10.1.1.3 Application Curves
    2. 10.2 Power Supply Recommendations
    3. 10.3 Layout
      1. 10.3.1 Layout Guidelines
      2. 10.3.2 Layout Example
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Thermal Information

THERMAL METRIC(1) ISOM811x UNIT
DFG (SOIC)
4 PINS
RθJA Junction-to-ambient thermal resistance 288.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 173.6 °C/W
RθJB Junction-to-board thermal resistance 192.9 °C/W
ψJT Junction-to-top characterization parameter 121.9 °C/W
ψJB Junction-to-board characterization parameter 190 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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