ZHCSNI5 May   2021 ISOS141-SEP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  7. 7 Operating Life Deration
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Radiation Tolerance
      2. 9.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.8 Safety Limiting Values

Safety limiting#A_ISO104X_SAFETY_LIMITING_V1_SAFETY_LIMITING_VALUES_FOOTER1_SF1_SF1 intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DBQ-16 PACKAGE
IS Safety input, output, or supply current RθJA =109°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C
See GUID-2F9CF3D5-D814-4CA3-A2BD-2CEBEB7E9D12.html#SLLSEP41947 		209 mA
RθJA = 109°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C
See GUID-2F9CF3D5-D814-4CA3-A2BD-2CEBEB7E9D12.html#SLLSEP41947 		319 mA
RθJA = 109°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C
See GUID-2F9CF3D5-D814-4CA3-A2BD-2CEBEB7E9D12.html#SLLSEP41947 		417
PS Safety input, output, or total power RθJA = 109°C/W, TJ = 150°C, TA = 25°C
See GUID-2F9CF3D5-D814-4CA3-A2BD-2CEBEB7E9D12.html#SLLSEP41063 		1147 mW
TS Maximum safety temperature 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.
 
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