ZHCSQR7A October   2023  – June 2024 ISOTMP35

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Insulation Specification
    6. 5.6  Power Ratings
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Features Description
      1. 6.3.1 Integrated Isolation Barrier and Thermal Response
      2. 6.3.2 Analog Output
        1. 6.3.2.1 Output Accuracy
        2. 6.3.2.2 Output Voltage Linearity
        3. 6.3.2.3 Drive Capability
        4. 6.3.2.4 Common Mode Transient Immunity (CMTI)
      3. 6.3.3 Thermal Response
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Voltage Linearity
      2. 7.1.2 Load Regulation
      3. 7.1.3 Start-Up Settling Time
      4. 7.1.4 Thermal Response
      5. 7.1.5 External Buffer
      6. 7.1.6 ADC Selection and Impact on Accuracy
      7. 7.1.7 Implementation Guidelines
      8. 7.1.8 PSRR
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Insulation Lifetime
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) ISOTMP35 UNIT
DFQ (SOIC)
7 PINS
RθJA Junction-to-ambient thermal resistance 116.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 38.8 °C/W
RθJB Junction-to-board thermal resistance 41.9 °C/W
ψJT Junction-to-top characterization parameter 38.3 °C/W
ψJB Junction-to-board characterization parameter N/A °C/W
MT Thermal Mass 51.0 mJ/°C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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