ZHCSNL9A May   2021  – December 2021 ISOW1044

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  ThermalInformation
    5. 8.5  Power Ratings
    6. 8.6  Insulation Specifications
    7. 8.7  Safety-Related Certifications
    8. 8.8  Safety Limiting Values
    9. 8.9  Electrical Characteristics
    10. 8.10 Supply Current Characteristics
    11. 8.11 Switching Characteristics
    12. 8.12 Insulation Characteristics Curves
    13. 8.13 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Power Isolation
    3. 10.3 Signal Isolation
    4. 10.4 CAN Transceiver
      1. 10.4.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
    5. 10.5 Functional Block Diagram
    6. 10.6 Feature Description
      1. 10.6.1 CAN Bus States
      2. 10.6.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 10.6.3 TXD Dominant Timeout (DTO)
      4. 10.6.4 Power-Up and Power-Down Behavior
      5. 10.6.5 Protection Features
      6. 10.6.6 Floating Pins, Unpowered Device
      7. 10.6.7 Glitch-Free Power Up and Power Down
    7. 10.7 Device Functional Modes
    8. 10.8 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Bus Loading, Length and Number of Nodes
        2. 11.2.2.2 CAN Termination
      3. 11.2.3 Application Curve
      4. 11.2.4 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 支持资源
    4. 14.4 Trademarks
    5. 14.5 静电放电警告
    6. 14.6 术语表
  15. 15Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 ThermalInformation

THERMAL METRIC(1) ISOW1044 UNIT
DFM
20 PINS
RθJA Junction-to-ambient thermal resistance 68.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.9 °C/W
RθJB Junction-to-board thermal resistance 44.8 °C/W
ΨJT Junction-to-top characterization parameter 13 °C/W
ΨJB Junction-to-board characterization parameter 44 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance -- °C/W
(1) For more informationabout traditional and new thermal metrics, see theSemiconductor andIC Package Thermal Metrics application report.
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