ZHCSNF0B May   2018  – October 2021 ISOW1412 , ISOW1432

PRODMIX  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Recommended Operating Conditions
    3. 8.3  Thermal Information
    4. 8.4  Power Ratings
    5. 8.5  Insulation Specifications
    6. 8.6  Safety-Related Certifications
    7. 8.7  Safety Limiting Values
    8. 8.8  Electrical Characteristics
    9. 8.9  Supply Current Characteristics at VISOOUT = 3.3 V
    10. 8.10 Supply Current Characteristics at  VISOOUT = 5 V
    11. 8.11 Switching Characteristics at VISOOUT = 3.3 V
    12. 8.12 Switching Characteristics at VISOOUT = 5 V
    13. 8.13 Insulation Characteristics Curves
    14. 8.14 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Power Isolation
    3. 10.3 Signal Isolation
    4. 10.4 RS-485
    5. 10.5 Functional Block Diagram
    6. 10.6 Feature Description
      1. 10.6.1 Power-Up and Power-Down Behavior
      2. 10.6.2 Protection Features
      3. 10.6.3 Failsafe Receiver
      4. 10.6.4 Glitch-Free Power Up and Power Down
    7. 10.7 Device Functional Modes
    8. 10.8 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Data Rate, Bus Length and Bus Loading
        2. 11.2.2.2 Stub Length
        3. 11.2.2.3 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 支持资源
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 术语表
  15. 15Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

Over recommended operating conditions, typical values are at VDD = VIO = 3.3 V and TA =25°C, GND1 = GNDIO, GND2 = GISOIN (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Device
VISOOUT Isolated output supply voltage MODE=GND2, DE=GND1, D, RE and IN floating 3.135 3.3V 3.465 V
Isolated output supply voltage MODE=VISOOUT, DE=GND1, D, RE and IN floating 4.75 5 5.25 V
VOH Output high voltage on OUT pin VIO = 5 V ± 10%, IOH = –4 mA, IN=VISOIN VIO – 0.4 V
Output high voltage on OUT pin VIO = 3.3 V ± 10% , IOH = –2 mA, IN=VISOIN VIO – 0.3 V
Output high voltage on OUT pin VIO = 2.5 V ± 10% , IOH = –1 mA, IN=VISOIN VIO – 0.2 V
Output high voltage on OUT pin VIO = 1.8 V ± 5%, IOH = –1 mA, IN=VISOIN VIO – 0.2 V
VOL Output low voltage on OUT pin VIO = 5 V ± 10%, IOL = 4 mA, IN=GND2 0.4 V
Output low voltage on OUT pin VIO = 3.3 V ± 10% , IOL = 2 mA, IN=GND2 0.3 V
Output low voltage on OUT pin VIO = 2.5 V ± 10%, IOL = 1 mA, IN=GND2 0.2 V
Output low voltage on OUT pin VIO = 1.8 V ± 5%, IOL = 1 mA, IN=GND2 0.2 V
II Input current, IN IN at 0 V or VISOIN –25 25 µA
II Input current, EN EN at 0 V or VIO –25 25 µA
|CMH| High-level common-mode transient immunity Driver and receiver path, VCM = 1000 V, see Figure 9-4 100 kV/µs
|CML| Low-level common-mode transient immunity Driver and receiver path, VCM = 1000 V, see Figure 9-4 100 kV/µs
Driver
|VOD| Differential output voltage magnitude Unloaded bus, VDD = 3 V to 3.6 V with MODE=GND2, or 4.5 V to 5.5 V with MODE= VISOOUT 1.5 VISOIN V
RL = 60 Ω, –7 V ≤ VTEST ≤ 12 V (see Figure 9-1), VDD = 3 V to 3.6 V, MODE = GND2 1.5 VISOIN
RL = 100 Ω (see Figure 9-2) (RS-422 load),  VDD = 3 V to 3.6 V, MODE = GND2 2 VISOIN
RL = 54 Ω (see Figure 9-2) (RS-485 load), VDD = 3 V to 3.6 V, MODE = GND2 1.5 VISOIN
|VOD| Differential output voltage magnitude RL = 54 Ω, VDD = 4.5 V to 5.5 V, MODE = VISOOUT , see Figure 9-2 2.1 VISOIN V
|VOD| Differential output voltage magnitude RL = 100 Ω (see Figure 9-2) (RS-422 load),  VDD = 4.5 V to 5.5 V, MODE = VISOOUT 2.1 VISOIN V
|VOD| Differential output voltage magnitude RL = 60 Ω, –7 V ≤ VTEST ≤ 12 V (see Figure 9-1), VDD = 4.5 V to 5.5V, MODE = VISOOUT 2.1 VISOIN V
Δ|VOD| Change in differential output voltage between the two states RL = 54 Ω or 100 Ω (see Figure 9-2) –200 200 mV
VOC Common-mode output voltage RL = 54 Ω or 100 Ω (see Figure 9-2) 1 0.5 × VISOIN 3 V
ΔVOC(SS) Change in steady-state common-mode output voltage between the two states RL = 54 Ω or 100 Ω (see Figure 9-2) –200 200 mV
VOC(PP) Peak-to-peak common mode output voltage RL = 54 Ω or 100 Ω, VISOIN=VISOOUT=3.3V, see Figure 9-2 400 mV
IOS Short-circuit output current VDE = VIO, VD=VIO or GND1,  –7 V ≤ Y or Z ≤ 12 V, or Y shorted to Z, see Figure 9-10 180 mA
II Input current , D, DE VD, VDE at 0 V or VIO –25 25 µA
Receiver
II1 Bus input current VDE = 0 V, VISOIN = 0 V or 3.3 V or 5V, ISOW1412 or ISOW1432, VA or VB = –7 V to 12 V, other input at 0 V –100 125 µA
VTH+ Positive-going input-threshold voltage –7 V ≤ VCM ≤ 12 V See(1) –78 –20 mV
VTH– Negative-going input-threshold voltage –7 V ≤ VCM ≤ 12 V –200 –141 See(1) mV
Vhys Input hysteresis (VTH+ – VTH–) –7 V ≤ VCM ≤ 12 V 40 63 mV
VOH Output high voltage on R pin VIO = 5 V ± 10%, IOH = –4 mA, VID ≥ 200 mV VIO – 0.4 V
VIO = 3.3 V ± 10%, IOH = –2 mA, VID ≥ 200 mV VIO – 0.3
VIO = 2.5 V ± 10% , IOH = –1 mA, VID ≥ 200 mV VIO – 0.2
VIO = 1.8 V ± 5%, IOH = –1 mA, VID ≥ 200 mV VIO – 0.2
VOL Output low voltage on R pin VIO = 5 V ± 10%, IOL = 4 mA, VID ≤ –200 mV 0.4 V
VIO = 3.3 V ± 10%, IOL = 2 mA, VID ≤ –200 mV 0.3
VIO = 2.5 V ± 10% , IOL = 1 mA, VID ≤ –200 mV 0.2
VIO = 1.8 V ± 5%, IOL = 1 mA, VID ≤ –200 mV 0.2
IOZ Output high-impedance current on R pin VR = 0 V or VIO, VRE = VIO –1 1 µA
II(RE) Input current on RE pin VRE at 0 V or VIO –25 25 µA
The VTH+ voltage is specified to be greater than the VTH– voltage by at least the Vhys voltage under any specific conditions.