The integrated signal isolation channels employ an ON-OFF keying (OOK) modulation scheme to transmit the digital data across a silicon-dioxide based isolation barrier. The transmitter sends a high frequency carrier across the barrier to represent one state and sends no signal to represent the other state. The receiver demodulates the signal after signal conditioning and produces the output through a buffer stage. The signal-isolation channels incorporate advanced circuit techniques to maximize the CMTI performance and minimize the radiated emissions from the high frequency carrier and IO buffer switching. Figure 9-1 shows a functional block diagram of a typical signal isolation channel. In order to keep any noise coupling from the power converter away from the signal path, power supplies on side 1 for the power converter (V_DD) and the signal path(V_IO) are kept separate. Similarly on side 2, the power converter output (V_ISOOUT) needs to be connected to V_ISOIN externally on PCB. Emissions can be further improved by placing a ferrite bead between V_ISOOUT and V_ISOIN as well as between the GND2 pins. For more details, refer to the Layout Guidelines section.