ZHCSET4B December   2015  – April 2024 LDC0851

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Interface Voltage Levels
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Basic Operation Mode
      2. 6.3.2 Threshold Adjust Mode
      3. 6.3.3 Setting the Threshold Adjust Values
      4. 6.3.4 Hysteresis
      5. 6.3.5 Conversion Time
      6. 6.3.6 Power-Up Conditions
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Sensor Design
        1. 7.1.1.1 Sensor Frequency
        2. 7.1.1.2 Sensor Design Procedure
    2. 7.2 Typical Application
      1. 7.2.1 Event Counting
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Coarse Position Sensing
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 Low Power Operation
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Side by Side Coils
        2. 7.4.2.2 Stacked Coils
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

The LDC0851 requires minimal external components for effective operation. An LDC0851 design should follow good layout techniques - providing good grounding and clean supplies are critical for optimum operation. Due to the small physical size of the LDC0851, use of surface mount 0402 or smaller components can ease routing. It is important to keep the routing symmetrical and minimize parasitic capacitances for LSENSE and LREF. The sensor capacitor should be placed close to the IC and keep traces far apart to minimize the effects of parasitic capacitance. For optimum performance, it is recommended to use a C0G/NP0 for the sensor capacitor.