ZHCSCB1 March   2014 LDC1041

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Terminal Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductive Sensing
      2. 7.3.2 Measuring Rp with LDC1041
      3. 7.3.3 Measuring Inductance with LDC1041
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 INTB Pin Modes
        1. 7.4.2.1 Comparator Mode
        2. 7.4.2.2 Wake-Up Mode
        3. 7.4.2.3 DRDYB Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Description
        1. 7.5.1.1 Extended SPI Transactions
    6. 7.6 Register Map and Description
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calculation of Rp_MIN and Rp_MAX
        1. 8.1.1.1 Setting Rp_MAX
        2. 8.1.1.2 Setting Rp_MIN
      2. 8.1.2 Output Data Rate
      3. 8.1.3 Choosing Filter Capacitor (CFA and CFB Terminals)
    2. 8.2 Typical Applications
      1. 8.2.1 Axial Distance Sensing Using a PCB Sensor with LDC1041
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sensor and Target
          2. 8.2.1.2.2 Calculating Sensor Capacitor
          3. 8.2.1.2.3 Choosing Filter Capacitor
          4. 8.2.1.2.4 Setting Rp_MIN and Rp_MAX
          5. 8.2.1.2.5 Calculating Minimum Sensor Frequency
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Linear Position Sensing Application Diagram
      3. 8.2.3 Angular Position Sensing Application Diagram
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Terminal Configuration and Functions

WSON-16
Top View
conndiag_snoscy1.gif

Terminal Description

TERMINAL NAME TERMINAL NO.
 TERMINAL TYPE (1)
FUNCTION
SCLK 1 DO SPI clock input. SCLK is used to clock-out/clock-in the data from/into the chip
CSB 2 DI SPI CSB(Chip Select Bar). Multiple devices can be connected on the same SPI bus and CSB can be used to select the device to be communicated with
SDI 3 DI SPI Slave Data In (Master Out Slave In). This should be connected to the Master Out Slave In of the master
VIO 4 P Digital IO Supply
SDO 5 DO SPI Slave Data Out (Master In Slave Out).It is high impedance when CSB is high
DGND 6 P Digital ground
CFB 7 A LDC filter capacitor
CFA 8 A LDC filter capacitor
INA 9 A External LC Tank. Connect to external LC tank
INB 10 A External LC Tank. Connect to external LC tank
GND 11 P Analog ground
VDD 12 P Analog supply
CLDO 13 A LDO bypass capacitor. A 56nF capacitor should be connected from this Terminal to GND
TBCLK 14 DI External time-base clock
N/C 15 N/C No Connection
INTB 16 DO Configurable interrupt. This Terminal can be configured to behave in 3 different ways by programing the INT Terminal mode register. Either threshold detect, wakeup, or DRDYB
DAP 17 P Connect to GND
(1) DO: Digital Output, DI: Digital Input, P: Power, A: Analog
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