ZHCSF01 April   2016 LDC1312-Q1 , LDC1314-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics - I2C
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clocking Architecture
      2. 8.3.2 Multi-Channel and Single Channel Operation
      3. 8.3.3 Current Drive Control Registers
      4. 8.3.4 Device Status Registers
      5. 8.3.5 Input Deglitch Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Startup Mode
      2. 8.4.2 Normal (Conversion) Mode
      3. 8.4.3 Sleep Mode
      4. 8.4.4 Shutdown Mode
        1. 8.4.4.1 Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Specifications
    6. 8.6 Register Maps
      1. 8.6.1  Register List
      2. 8.6.2  Address 0x00, DATA_CH0
      3. 8.6.3  Address 0x02, DATA_CH1
      4. 8.6.4  Address 0x04, DATA_CH2 (LDC1314 only)
      5. 8.6.5  Address 0x06, DATA_CH3 (LDC1314 only)
      6. 8.6.6  Address 0x08, RCOUNT_CH0
      7. 8.6.7  Address 0x09, RCOUNT_CH1
      8. 8.6.8  Address 0x0A, RCOUNT_CH2 (LDC1314 only)
      9. 8.6.9  Address 0x0B, RCOUNT_CH3 (LDC1314 only)
      10. 8.6.10 Address 0x0C, OFFSET_CH0
      11. 8.6.11 Address 0x0D, OFFSET_CH1
      12. 8.6.12 Address 0x0E, OFFSET_CH2 (LDC1314 only)
      13. 8.6.13 Address 0x0F, OFFSET_CH3 (LDC1314 only)
      14. 8.6.14 Address 0x10, SETTLECOUNT_CH0
      15. 8.6.15 Address 0x11, SETTLECOUNT_CH1
      16. 8.6.16 Address 0x12, SETTLECOUNT_CH2 (LDC1314 only)
      17. 8.6.17 Address 0x13, SETTLECOUNT_CH3 (LDC1314 only)
      18. 8.6.18 Address 0x14, CLOCK_DIVIDERS_CH0
      19. 8.6.19 Address 0x15, CLOCK_DIVIDERS_CH1
      20. 8.6.20 Address 0x16, CLOCK_DIVIDERS_CH2 (LDC1314 only)
      21. 8.6.21 Address 0x17, CLOCK_DIVIDERS_CH3 (LDC1314 only)
      22. 8.6.22 Address 0x18, STATUS
      23. 8.6.23 Address 0x19, ERROR_CONFIG
      24. 8.6.24 Address 0x1A, CONFIG
      25. 8.6.25 Address 0x1B, MUX_CONFIG
      26. 8.6.26 Address 0x1C, RESET_DEV
      27. 8.6.27 Address 0x1E, DRIVE_CURRENT_CH0
      28. 8.6.28 Address 0x1F, DRIVE_CURRENT_CH1
      29. 8.6.29 Address 0x20, DRIVE_CURRENT_CH2 (LDC1314 only)
      30. 8.6.30 Address 0x21, DRIVE_CURRENT_CH3 (LDC1314 only)
      31. 8.6.31 Address 0x7E, MANUFACTURER_ID
      32. 8.6.32 Address 0x7F, DEVICE_ID
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Theory of Operation
        1. 9.1.1.1 Conductive Objects in an EM Field
        2. 9.1.1.2 L-C Resonators
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Recommended Initial Register Configuration Values
        2. 9.2.2.2 Inductor Self-Resonant Frequency
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档　
    3. 12.3 社区资源
    4. 12.4 相关链接
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

Avoid long traces to connect the sensor to the LDC. Short traces reduce parasitic capacitances between sensor inductor and offer higher system performance.

11.2 Layout Example

Figure 57 to Figure 60 show the LDC1312 evaluation module (EVM) layout.

LDC1312-Q1 LDC1314-Q1 lay01_top_signal_snoscy9.png Figure 57. Example PCB Layout: Top Layer (Signal)
LDC1312-Q1 LDC1314-Q1 lay02_mid1_GND_snoscy9.png Figure 58. Example PCB Layout: Mid-layer 1 (GND)
LDC1312-Q1 LDC1314-Q1 lay03_mid2_power_snoscy9.png Figure 59. Example PCB Layout: Mid-layer 2 (Power)
LDC1312-Q1 LDC1314-Q1 lay04_bot_signal_snoscy9.png Figure 60. Example PCB Layout: Bottom Layer (Signal)
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