ZHCSF02 April 2016 LDC1612-Q1 , LDC1614-Q1
PRODUCTION DATA.
- 1 特性
- 2 应用
- 3 说明
- 4 修订历史记录
- 5 说明 （续）
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6
Register Maps
- 8.6.1 Register List
- 8.6.2 Address 0x00, DATA_MSB_CH0
- 8.6.3 Address 0x01, DATA_LSB_CH0
- 8.6.4 Address 0x02, DATA_MSB_CH1
- 8.6.5 Address 0x03, DATA_LSB_CH1
- 8.6.6 Address 0x04, DATA_MSB_CH2 (LDC1614 only)
- 8.6.7 Address 0x05, DATA_LSB_CH2 (LDC1614 only)
- 8.6.8 Address 0x06, DATA_MSB_CH3 (LDC1614 only)
- 8.6.9 Address 0x07, DATA_LSB_CH3 (LDC1614 only)
- 8.6.10 Address 0x08, RCOUNT_CH0
- 8.6.11 Address 0x09, RCOUNT_CH1
- 8.6.12 Address 0x0A, RCOUNT_CH2 (LDC1614 only)
- 8.6.13 Address 0x0B, RCOUNT_CH3 (LDC1614 only)
- 8.6.14 Address 0x0C, OFFSET_CH0
- 8.6.15 Address 0x0D, OFFSET_CH1
- 8.6.16 Address 0x0E, OFFSET_CH2 (LDC1614 only)
- 8.6.17 Address 0x0F, OFFSET_CH3 (LDC1614 only)
- 8.6.18 Address 0x10, SETTLECOUNT_CH0
- 8.6.19 Address 0x11, SETTLECOUNT_CH1
- 8.6.20 Address 0x12, SETTLECOUNT_CH2 (LDC1614 only)
- 8.6.21 Address 0x13, SETTLECOUNT_CH3 (LDC1614 only)
- 8.6.22 Address 0x14, CLOCK_DIVIDERS_CH0
- 8.6.23 Address 0x15, CLOCK_DIVIDERS_CH1
- 8.6.24 Address 0x16, CLOCK_DIVIDERS_CH2 (LDC1614 only)
- 8.6.25 Address 0x17, CLOCK_DIVIDERS_CH3 (LDC1614 only)
- 8.6.26 Address 0x18, STATUS
- 8.6.27 Address 0x19, ERROR_CONFIG
- 8.6.28 Address 0x1A, CONFIG
- 8.6.29 Address 0x1B, MUX_CONFIG
- 8.6.30 Address 0x1C, RESET_DEV
- 8.6.31 Address 0x1E, DRIVE_CURRENT_CH0
- 8.6.32 Address 0x1F, DRIVE_CURRENT_CH1
- 8.6.33 Address 0x20, DRIVE_CURRENT_CH2 (LDC1614 only)
- 8.6.34 Address 0x21, DRIVE_CURRENT_CH3 (LDC1614 only)
- 8.6.35 Address 0x7E, MANUFACTURER_ID
- 8.6.36 Address 0x7F, DEVICE_ID
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文档支持
- 13机械、封装和可订购信息
6 Pin Configuration and Functions
LDC1612-Q1 DNT
12 pin WSON
Top View
LDC1614-Q1 RGH
16 pin WQFN
Top View
Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | SCL | I | I2C Clock input |
| 2 | SDA | I/O | I2C Data input/output |
| 3 | CLKIN | I | Master Clock input. Tie this pin to GND if internal oscillator is selected |
| 4 | ADDR | I | I2C Address selection pin: when ADDR=L, I2C address = 0x2A, when ADDR=H, I2C address = 0x2B. |
| 5 | INTB | O | Configurable Interrupt output pin |
| 6 | SD | I | Shutdown input |
| 7 | VDD | P | Power Supply |
| 8 | GND | G | Ground |
| 9 | IN0A | A | External LC sensor 0 connection |
| 10 | IN0B | A | External LC sensor 0 connection |
| 11 | IN1A | A | External LC sensor 1 connection |
| 12 | IN1B | A | External LC sensor 1 connection |
| 13 | IN2A | A | External LC sensor 2 connection (LDC1614 only) |
| 14 | IN2B | A | External LC sensor 2 connection (LDC1614 only) |
| 15 | IN3A | A | External LC sensor 3 connection (LDC1614 only) |
| 16 | IN3B | A | External LC sensor 3 connection (LDC1614 only) |
| DAP | DAP(2) | N/A | Connect to Ground |
(1) I = Input, O = Output, P=Power, G=Ground, A=Analog
(2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the DAP as the primary ground for the device. The device GND pin must always be connected to ground.