ZHCSJ59C december   2018  – july 2023 LDC5072-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Diagnostics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Supply Voltage
      2. 8.3.2 Excitation Signal
      3. 8.3.3 Signal Processing Block
        1. 8.3.3.1 Demodulation
        2. 8.3.3.2 Fixed Gain Control
        3. 8.3.3.3 Automatic Gain Control
      4. 8.3.4 Output Stage
      5. 8.3.5 Diagnostics
        1. 8.3.5.1 Undervoltage Diagnostics
        2. 8.3.5.2 Initialization Diagnostics
        3. 8.3.5.3 Normal State Diagnostics
        4. 8.3.5.4 Fault State Diagnostics
    4. 8.4 Device Functional Modes
      1. 8.4.1 IDLE State
      2. 8.4.2 DIAGNOSTICS State
      3. 8.4.3 NORMAL State
      4. 8.4.4 FAULT State
      5. 8.4.5 DISABLED State
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 5-V Supply Mode
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VREG and VCC
          2. 9.2.1.2.2 Output Capacitors
          3. 9.2.1.2.3 AGC Mode
        3. 9.2.1.3 Application Curve
      2. 9.2.2 3.3-V Supply Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 VREG and VCC
          2. 9.2.2.2.2 Output Capacitors
          3. 9.2.2.2.3 Fixed Gain Mode
      3. 9.2.3 Redundancy Mode
      4. 9.2.4 Single-Ended Mode
      5. 9.2.5 External Diagnostics Required for Loss of VCC or GND
  11. 10Power Supply Recommendations
    1. 10.1 Mode 1: VCC = 5 V, VREG = 3.3 V
    2. 10.2 Mode 2: VCC = VREG = 3.3 V
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tVCC_FLT_DT    Deglitch time for VCC over voltage and under voltage detection 180 200 220 µs
tVREG_OV_DT    Deglitch time for VREG over voltage detection 180 200 220 µs
tLC_FLT_DT    Deglitch times for LC amplitude related faults 180 200 220 µs
tAGC_EN_DT    Deglitch time for AGC_EN pin  for AGC mode detection 2.7 3 3.3 µs
tAGC_EN_TGL_DT Deglitch time on AGC_EN pin toggle fault after power up into normal state 450 500 550 µs
tIN_OOR_DT    Deglitch time applied to each input out of range signal individually 180 200 220 µs
tINx_FLT_DT Deglitch time applied to the fault signal determined by OR of all individual input out of range faults which are deglitched for tIN_OOR_DT 180 200 220 µs
tLPF_OOR_DT Deglitch time for AFE Low Pass Filter Out of Range check 180 200 220 µs
tOUT_OOR_DT    Deglitch time for output voltage out of range fault. 180 200 220 µs
tOUTx_SHORT_DT Degltich time for AFE Output Short detection 450 500 550 µs
tOUT_CM_DT Deglitch time for OUT pin common mode check 90 100 110 µs
tOUT_ZC_DT Deglitch time for OUT differential output zero crossing fault detection 9 10 11 µs
tAGC_ZC_DT   Deglitch time for AGC differential output zero crossing fault detection 9 10 11 µs
tAGC_CMP_DT Deglitch time to detect AGC fast/slow amplitude regulation threshold has been crossed 180 200 220 ns
tAGC_VAL_DT Deglitch time for AGC OOR range faults 180 200 220 µs
tFLT_RECOV   Fault recovery time once device tranistions from FAULT to DIAGNOSTIC state CEXT_VREG=680nF, 2.2µF 12 16 ms
tP‎WR_ON From VREG power on until OUTx pins are released from HI-Z state. CEXT_VREG=680nF, 2.2µF 10 14 ms
tPR‎WR_ON_DT  Deglitch time after tPWR_ON for which OUTx faults are ignored.  302 336 370 µs
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