6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)(2)
|
MIN |
MAX |
UNIT |
| Maximum Input to Output Voltage Differential |
LM1086-ADJ |
|
29 |
V |
| LM1086-1.8 |
|
27 |
V |
| LM1086-2.5 |
|
27 |
V |
| LM1086-3.3 |
|
27 |
V |
| LM1086-5.0 |
|
25 |
V |
| Power Dissipation(3) |
Internally Limited |
|
| Junction Temperature (TJ)(4) |
|
150 |
°C |
| Lead Temperature |
|
260, to 10 sec |
°C |
| Storage temperature, Tstg |
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to
Overload Recovery in
Application and Implementation. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401).
(4) The maximum power dissipation is a function of T
J(MAX) , θ
JA, and T
A. The maximum allowable power dissipation at any ambient temperature is P
D = (T
J(MAX)–T
A)/θ
JA. All numbers apply for packages soldered directly into a PC board. Refer to
Thermal Considerations